Fabrication and simulation of organic transistors and functional circuits

Taylor, D.M. and Patchett, E.R. and Williams, A. and Ding, Z. and Assender, H.E. and Morrison, J.J. and Yeates, S.G. (2014) Fabrication and simulation of organic transistors and functional circuits. Chemical Physics, 456. pp. 85-92. DOI: 10.1016/j.chemphys.2014.12.009

31893.pdf - Published Version
Available under License Creative Commons Attribution.

Download (2MB) | Preview


We report the development of a vacuum-evaporation route for the roll-to-roll fabrication of functioning organic circuits. A number of key findings and observations are highlighted which influenced the eventual fabrication protocol adopted. Initially, the role of interface roughness in determining carrier mobility in thin film transistors (TFTs) is investigated. Then it is shown that TFT yield is higher for devices fabricated on a flash-evaporated-plasma-polymerised tri(propyleneglycol) diacrylate (TPGDA) gate dielectric than for TFTs based on a spin-coated polystyrene (PS) dielectric. However, a degradation in mobility is observed which is attributed to the highly polar TPGDA surface. It is shown that high mobility, low gate-leakage currents and excellent stability are restored when the surface of TPGDA was buffered with a thin, spin-coated PS film. The resulting baseline process allowed arrays of functional circuits such as ring oscillators, NOR/NAND logic gates and S�R latches to be fabricated with high yield and their performance to be simulated.

Item Type: Article
Subjects: Research Publications
Departments: College of Physical and Applied Sciences > School of Electronic Engineering
Date Deposited: 19 Mar 2015 03:09
Last Modified: 23 Sep 2015 02:50
ISSN: 0301-0104
URI: http://e.bangor.ac.uk/id/eprint/3663
Identification Number: DOI: 10.1016/j.chemphys.2014.12.009
Publisher: Elsevier
Administer Item Administer Item

eBangor is powered by EPrints 3 which is developed by the School of Electronics and Computer Science at the University of Southampton. More information and software credits.